What is a millimeter wave in 5G technology

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The millimeter wave frequency range offers a uniquely enormous bandwidth compared to the spectrum of most current wireless communication and radar systems. Therefore, MM-wave frequencies are currently used for the development of future broadband high-speed systems and high-resolution high-frequency applications. The 5th generation of mobile communications (5G) will probably use the MM wave frequency band in order to overcome the limitations of the 4G system. In contrast to 4G, 5G networks and systems are optimized for both human (HCC) and machine (MTC) communication. Therefore, 5G has the potential to become a key technology for bandwidth, speed and latency critical HCC / MTC applications. These include telediagnostics and telesurgery, vehicle-to-vehicle and vehicle-to-vehicle infrastructure communication for autonomous vehicles, wireless transmission of uncompressed high-resolution videos, applications in the field of augmented and virtual reality, tactile internet and a large number of IoT applications that provide intelligent solutions for healthcare , Energy supply, logistics, industrial production (Industry 4.0) and urban planning.

The development of 5G and other MM waves high-frequency systems poses enormous tasks due to the propagation properties of MM waves, such as high path losses, multipath propagation and shadowing. To meet these challenges, new signal processing algorithms (e.g. for massive MIMO), network architectures and protocols, transceiver ICs, MM-wave antenna systems and RF system integration approaches are required. HF system integration is the development of HF hardware systems through the integration of ICs, antennas, passives and other system components in system integration platforms and system substrates.

Fraunhofer IZM focuses on innovative RF designs of miniaturized MM-wave smart antenna systems and system integration for RF and photonic modules. The work is based on a combination of our holistic RF design approach (M3 approach: methods, models, measures), the unique possibilities in the field of thermal design and thermo-mechanical reliability as well as the advanced assembly, encapsulation and system integration technologies, combine the wafer level and substrate integration approaches. In cooperation with our partners from industry and research, we develop new MM waves RF components, modules and systems for future wireless and photonic communication applications as well as radar sensors.
 

We offer the following services


RF modeling, design and testing

  • Characterization of dielectric materials based on RF measurements up to 0.22 THz
  • RF modeling, design and testing of miniaturized MM-wave antennas and antenna systems
  • Development of isolation structures for the system integration of mixed-signal applications
  • RF design of passives, interconnects, system integration platforms and system boards
  • RF system integration and design taking into account signal and power integrity and intrasystem EMC
  • Design and integration of high-performance wireless sensor nodes and systems

Photonic modeling, design and testing

  • Characterization of photonic components through measurements in the wavelength range 600-1600 nm
  • Photonic modeling, design and testing of photonic ICs and sub-systems
  • Development of photonic interconnects for system integration with high bandwidths
  • Photonic system integration taking into account latency, power consumption and scalability
  • Design and integration of powerful photonic systems

Thermo-mechanical modeling and design, environmental and reliability assessment

  • Thermal and thermo-mechanical design of MM-wave RF systems
  • Evaluation of thermal management and reliability
  • Modeling of power consumption at component and system level
  • Evaluation of critical materials and optimization of resource efficiency

Assembly, encapsulation and system integration

Advanced assembly, encapsulation and system integration of miniaturized MM-wave RF systems using wafer and board-level technologies, such as

  • Fan-in and fan-out wafer / panel-level packaging
  • 3D stacking / chip integration
  • Embedding in silicon and circuit boards
  • Silicon and glass interposers
  • Photonic board integration

Contact us to find solutions to the challenges of 5G and MM-wave RF systems together. We look forward to welcoming you as a future cooperation partner.